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| APLUS MAKE YOUR PRODUCTION A-PLUS APExx24 Series DATA SHEET APLUS INTEGRATED CIRCUITS INC. Sales E-mail: sales@aplusinc.com.tw Technology E-mail: service@aplusinc.com.tw Address: 3 F-10, No. 32, Sec. 1, Chenggung Rd., Taipei, Taiwan 115, R.O.C. (115) 32 3 10. TEL: 886-2-2782-9266 FAX: 886-2-2782-9255 WEBSITE : http: //www.aplusinc.com.tw APExx24 Series 1.0 General Description The APExx24 series are very low cost voice and melody synthesizer with 4-bits CPU. They have various features including 4-bits ALU, ROM, RAM, I/O ports, timers, clock generator, voice and melody synthesizer, and PWM (Direct drive) or D/A current outputs, etc. The audio synthesizer contains one voice-channel and two melody-channels. Furthermore, they consist of 27 instructions in these devices. With CMOS technology and halt function can minimize power dissipation. Their architectures are similar to RISC, with two stages of instruction pipeline. They allow all instructions to be executed in a single cycle, except for program branches and data table read instructions (which need two instruction cycles). 2.0 Features (1) Single power supply can operate from 2.4V to 5.5V at 4MHz or 8MHz. (2) Program ROM: 64k x 10 bits (3) 1 set of 16-bits DPR can access up to 64k x 10 bits melody data memory space, and 1 set of 20-bits VPR can access up to 1024k x 10 bits voice data memory space. Product APE12724 APE17024 APE25524 APE34024 (4) Data Registers: a). 128 x 4-bits data RAM (00-7Fh) b). Unbanked special function registers (SFR) range: 00h-2Fh (5) I/O Ports: a). PRA: 4-bits I/O Port A (10h) can be programmed to input/output individually. (Register control) b). PRB: 4-bits I/O Port B (13h) can be configured to input/output individually. (Mask option) c). PRC: 4-bits I/O Port C (14h) can be programmed to input/output individually. (Register control) d). PRD: 4-bits I/O Port D (15h) can be programmed to input/output individually. (Register control) e). PRE: 4-bits I/O Port E (17h) can be programmed to input/output individually. (Register control) f). PRF: 4-bits I/O Port F (18h) can be programmed to input/output individually. (Register control) (6) On-chip clock generator: Resistive Clock Drive (RM) or Crystal oscillator (HM) (7) Timer: 1-set Voice Interrupt (Timer0: a 9-bits auto-reload timer/counter). (8) Stack: 2-level subroutine nesting. (9) Built-in 4 Level Volume Control can be programmed. (10) Built-in 8 Level DAC Current Control can be configured. (Mask option) (11) Built-in IR Carry Output: Port B[1] can be configured as IR pin by 38k / 56kHz. (Mask option) 1 Rev 1.1 2003/9/2 Voice Duration (sec) Voice Pointer (VPR) ROM Size (10-bits) 127 170 255 340 19-bits 19-bits 20-bits 20-bits 384k 512k 768k 1024k APExx24 Series (12) External Reset: Port B[3] can be configured as reset pin. (Mask opton) (13) HALT and Release from HALT function to reduce power consumption (14) Watch Dog Timer (WDT) (15) Instruction: 1-cycle instruction except for table read and program branches which are 2-cycles (16) Number of instruction: 27 (17) DAC: 1 channel voice and dual tone melody synthesizer (One 9-bits Cout or 8-bits PWM output). FIGURE 1 : ROM Map of APExx24 Series PC[15:0] 16-bit x 2 STACK 16-bit Data Pointer 20-bit Voice Pointer Reset Vector 00000h 000FEh 000FFh-00400h 00401h Reserved for Testing 00000h-0FFFFh Data ROM for Melody 00000h-0FFFFh Program ROM 00000h-FFFFFh Voice ROM for Voice 2 Rev 1.1 2003/9/2 APExx24 Series 3.0 Pin Description Pad Name PWM2/Cout PWM1 Vdd1~3 PRA0~3 PRC0~3 PRD0~3 PRE0~3 PRF0~3 PRB0 / OSC2 Pin Attr. O O Power Description PWM2 output, or Current Output of Audio. PWM1 output. Power supply during operation. I/O port can be programmed to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. I/O port can be configured to input/output individually or HM OSC pad. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. I/O port can be configured to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. Mask option selected as an IR Carrier Output with 38k / 56kHz I/O port can be configured to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. I/O port can be configured to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. Mask option selected as an external RESET pin with weak pull-low capability. RM/HM mode Oscillator input Ground Potential I/O I/O PRB1 / IR I/O PRB2 I/O PRB3 / Reset I/O OSC1 GND1~4 I Power 4.0 DC Characteristics Symbol Vdd Isb Iop Iih Ioh Iol Cout dF/F dF/F Parameter Operating voltage Supply current Standby Operating Vdd 3 4.5 3 4.5 3 4.5 3 4.5 3 4.5 3 4.5 -5 -10 Min. 2.4 Typ. 3 Max. 5.5 1 1 Unit V uA mA uA Condition depending on Freq. 4MHz, RM, in HALT Mode 4MHz, RM, IO Floating Input ports with weak pull-low 4MHz, RM (IO ports) 4MHz, RM (Full scale) Fosc(3v- 2.4v) Fosc (3v) Vdd=3V, Rosc=180k, 4MHz Rev 1.1 2003/9/2 Input current (Internal pull low) Output-high current Output-low current DAC output current (8-level option) Frequency stability Fosc lot variation 2 7 3 10 -3 -10 7 19 0.8 ~ 4.8 0.9 ~ 6.5 5 10 mA mA % % 3 APExx24 Series FIGURE 2 : Frequency vs. Rosc (at 3V) Resistor (Rosc ohms) Frequency (MHz) 110k 14.84 200k 8.25 300k 5.54 430k 3.92 R o sc vs F re q. 20 Freq. (MHz) 15 10 5 0 0 100 1 4 .8 4 8 .25 5 .54 3 .92 200 300 400 500 R os c (k o h m ) 5.0 Application Circuit 4 Rev 1.1 2003/9/2 APExx24 Series 6.0 Bonding Diagram of APE12724 / APE17024 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 Vdd1 PRF3 PRF2 PRF1 PRF0 PRE3 PRE2 PRE1 PRE0 PRD3 PRD2 PRD1 PRD0 PRC3 PRC2 PRC1 GND1 ROM Y 1 2 Chip Size : 2330 um x 2860um GND4 Pad Size : 80 um x 80 um GND3 * The IC substrate must be connected to GND. GND2 17 3 PWM1 Vdd3 PWM2/Cout Vdd2 OSC1 PRB0 PRB1 PRB2 PRB3 PRA0 PRA1 PRA2 PRA3 PRC0 4 (0,0) 6 5 7 8 9 10 11 12 13 14 15 16 X Pad # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Pad Name GND4 GND3 PWM1 Vdd3 PWM2/Cout Vdd2 OSC1 PRB0/OSC2 PRB1/IR PRB2 PRB3/Reset PRA0 PRA1 PRA2 PRA3 PRC0 GND2 X 75 57 56 183 467 988 1106 1224 1342 1460 1578 1696 1814 1932 2050 2168 2160 Y 404 293 145 60 58 86 86 86 86 86 86 86 86 86 86 86 230 Pad # 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Pad Name GND1 PRC1 PRC2 PRC3 PRD0 PRD1 PRD2 PRD3 PRE0 PRE1 PRE2 PRE3 PRF0 PRF1 PRF2 PRF3 Vdd1 X 2033 1920 1807 1694 1581 1468 1355 1242 1129 1016 903 790 676 563 450 337 223 Y 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 2688 5 Rev 1.1 2003/9/2 APExx24 Series 6.2 Bonding Diagram of APE25524 / APE34024 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 Vdd1 PRF3 PRF2 PRF1 PRF0 PRE3 PRE2 PRE1 PRE0 PRD3 PRD2 PRD1 PRD0 PRC3 PRC2 PRC1 GND1 ROM Y 1 2 Chip Size : 2330 um x 4680 um GND4 Pad Size : 80 um x 80 um GND3 * The IC substrate must be connected to GND. GND2 17 3 PWM1 Vdd3 PWM2/Cout Vdd2 OSC1 PRB0 PRB1 PRB2 PRB3 PRA0 PRA1 PRA2 PRA3 PRC0 4 (0,0) 6 5 7 8 9 10 11 12 13 14 15 16 X Pad # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Pad Name GND4 GND3 PWM1 Vdd3 PWM2/Cout Vdd2 OSC1 PRB0/OSC2 PRB1/IR PRB2 PRB3/Reset PRA0 PRA1 PRA2 PRA3 PRC0 GND2 X 75 58 56 183 467 988 1106 1224 1342 1460 1578 1696 1814 1932 2050 2168 2160 Y 404 293 145 60 58 86 86 86 86 86 86 86 86 86 86 86 230 Pad # 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Pad Name GND1 PRC1 PRC2 PRC3 PRD0 PRD1 PRD2 PRD3 PRE0 PRE1 PRE2 PRE3 PRF0 PRF1 PRF2 PRF3 Vdd1 X 2033 1920 1807 1694 1581 1468 1355 1242 1129 1016 903 790 676 563 450 337 223 Y 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 4508 6 Rev 1.1 2003/9/2 |
Price & Availability of APE17024
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